Download Advanced MEMS packaging by John H. Lau ... [et al.] PDF

By John H. Lau ... [et al.]

ISBN-10: 1615831592

ISBN-13: 9781615831593

Creation to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complicated MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble change --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

Show description

Read Online or Download Advanced MEMS packaging PDF

Similar nanostructures books

Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

The foreign marketplace is particularly aggressive for high-tech brands to­ day. reaching aggressive caliber and reliability for items calls for chief­ send from the head, stable administration practices, powerful and effective operation and upkeep structures, and use of acceptable updated engineering de­ signal instruments and techniques.

Nanostructures in biological systems : theory and applications

This booklet is a survey at the theoretical in addition to experimental effects on nanostructures in organic structures. It exhibits how a unifying procedure ranging from single-particle strength, deriving loose power of the procedure and opting for the equilibrium by means of minimizing the loose strength, should be utilized to explain electric and elastic phenomena.

Electrodeposition of Nanostructured Materials

This booklet offers an outline of electrodeposition of nanomaterials from ideas to fashionable techniques for complex fabrics in technology and know-how. Electrochemical deposition or electrodeposition is defined for fabrication and mass construction of sensible and nanostructured equipment fabrics.

Introduction to nanoelectronic single-electron circuit design

In creation to Nanoelectronic Single-electron Circuit layout, single-electron circuits are studied as an advent to the quickly increasing box of nanoelectronics. taken care of are either the research and synthesis of circuits with the nanoelectronic steel single-electron tunneling (SET) junction machine.

Additional info for Advanced MEMS packaging

Example text

Hartzell, John Walter (Camas, WA), Zhan, Changqing (Vancouver, WA), Wolfson, Michael Barrett (Somerville, MA), “MEMS pixel sensor,” September 16, 2008. 7 8 Chapter One 7,424,198 7,422,962 7,416,938 7,415,870 7,414,310 7,408,250 7,405,860 7,405,466 7,405,100 7,402,878 Palmateer, Lauren (San Francisco, CA), Cummings, William J. (San Francisco, CA), Gally, Brian (San Rafael, CA), Miles, Mark (San Francisco, CA), Sampsell, Jeffrey B. (San Jose, CA), Chui, Clarence (San Mateo, CA), Kothari, Manish (Cupertino, CA), “Method and device for packaging a substrate,” September 9, 2008.

MEMS device airtightness packaging method,” Chen, Jing (CN), Wu, Yexian (CN) (+1), CN101234745 (A)—2008-08-06. 22. “Orientation-dependent etching of deposited AIN for structural use and sacrificial layers in MEMS,” Bouche, Guillaume (US), Wall, Ralph N. (US), US2008268575 (A1)—2008-10-30. 23. “Packaging a MEMS device using a frame,” Natarajan, Bangalore R. (US), EP1979268 (A2)—2008-10-15. 24. “Microelectromechanical systems, and methods for encapsualting and fabricating same,” Partridge, Aaron (US), Lutz, Markus (US) (+1), US2008237756 (A1)—2008-10-02.

2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2008. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05.

Download PDF sample

Rated 4.62 of 5 – based on 30 votes